Display device and electronic apparatus

ABSTRACT

A display device includes pixel circuits disposed on a substrate, each of the pixel circuits comprising a transistor and a storage capacitor, display elements electrically connected to the pixel circuits, and a metal layer disposed between the substrate and the pixel circuits, the metal layer comprising through-holes, wherein the through-holes of the metal layer include a first through-hole, and a second through-hole disposed adjacent to the first through-hole.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to and benefits of Korean PatentApplication No. 10-2020-0027982 under 35 U.S.C. § 119, filed in theKorean Intellectual Property Office on Mar. 5, 2020, the entire contentsof which is incorporated herein by reference.

BACKGROUND 1. Technical Field

Embodiments of the disclosure relate to a display device and anelectronic apparatus including the display device.

2. Description of the Related Art

Display devices have been widely used. Furthermore, as the thickness andweight of a display device have been reduced, a use range thereof hasbeen increased.

As the area of a display area in a display device has been increased,various functions combined or linked to a display device have beenadded. As a method to add various functions while increasing displayarea, research has been conducted into a display device having an areafor both adding various functions and displaying an image.

It is to be understood that this background of the technology sectionis, in part, intended to provide useful background for understanding thetechnology. However, this background of the technology section may alsoinclude ideas, concepts, or recognitions that were not part of what wasknown or appreciated by those skilled in the pertinent art prior to acorresponding effective filing date of the subject matter disclosedherein.

SUMMARY

In order to add various functions, a component such as a camera or asensor may be disposed. A component may be disposed to overlap a displayarea to secure a larger display area. As a method of displaying acomponent, a display device may include a transmission area in which awavelength such as light or sound may be transmitted.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments of the disclosure.

According to an embodiment of the disclosure, a display device mayinclude pixel circuits disposed on a substrate, each of the pixelcircuits comprising a transistor and a storage capacitor, displayelements electrically connected to the pixel circuits, and a metal layerdisposed between the substrate and the pixel circuits, the metal layercomprising through-holes, wherein the through-holes of the metal layermay include a first through-hole and a second through-hole disposedadjacent to the first through-hole.

The metal layer may include a metal part between the first through-holeand the second through-hole, and the metal part may overlap the pixelcircuits and the display elements.

The first through-hole may have a shape, a size, or a width which isdifferent from that of the second through-hole.

At least one of the first through-hole and the second through-hole mayinclude corner parts disposed in different directions from a center.

At least one of the first through-hole and the second through-hole mayinclude a side edge between adjacent corner parts, and the side edge maybe curved.

The side edge may include an uneven part.

The first through-hole may include four corner parts disposed in fourdifferent directions from a first center, the second through-hole mayinclude four corner parts disposed in four different directions from asecond center, and one or more corner parts of the first through-holeand one or more corner parts of the second through-hole may be adjacentto each other.

The first through-hole may entirely surround the second through-hole.

At least one of the first through-hole and the second through-hole mayinclude protruding portion.

The metal layer may further include a fine hole disposed between thefirst through-hole and the second through-hole.

According to another embodiment of the disclosure, an electronicapparatus may include a display device including at least onetransmission area, and a component disposed below the at least onetransmission area, wherein the display device may include pixel circuitsdisposed on a substrate, each of the pixel circuits including atransistor and a storage capacitor, display elements electricallyconnected to the pixel circuits, and a metal layer disposed between thesubstrate and the pixel circuits, the metal layer including a firstthrough-hole and a second through-hole.

The metal layer may include a metal part between the first through-holeand the second through-hole, and the metal part may overlap the pixelcircuits and the display elements.

The metal part may include a fine hole.

An edge of at least one of the first through-hole and the secondthrough-hole may include an uneven part.

At least one of the first through-hole and the second through-hole mayinclude four corner parts disposed in four different directions from acenter, and a curved side edge may be between two neighboring cornerparts of the four corner parts.

At least one of the first through-hole and the second through-hole mayinclude a fine concave portion or a fine protruding portion.

Each of the first through-hole and the second through-hole may includefour corner parts, and the first through-hole and the secondthrough-hole may be arranged such that at least one of the corner partsof the first through-hole and at least one of the corner parts of thesecond through-hole may be adjacent to each other.

The first through-hole may entirely surround the second through-hole.

A width of the first through-hole may be about 200 μm to about 300 μm.

The component may include at least one of a sensor and a camera.

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdescription, the accompanying drawings, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIGS. 1A and 1B are schematic perspective views of an electronicapparatus according to an embodiment of the disclosure;

FIGS. 2A to 2C are schematic cross-sectional views of a part of anelectronic apparatus according to an embodiment of the disclosure;

FIG. 2D is a schematic cross-sectional view of a part of an electronicapparatus according to an embodiment of the disclosure.

FIGS. 3A and 3B are schematic plan views of a display device accordingto an embodiment of the disclosure.

FIG. 4 is a schematic circuit diagram of a pixel circuit connected to anorganic light-emitting diode of a display device according to anembodiment of the disclosure;

FIG. 5 is a schematic plan view of a part of a first display area of adisplay device according to an embodiment of the disclosure;

FIG. 6 is a schematic plan view of a second display area of a displaydevice according to an embodiment of the disclosure;

FIG. 7 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 8 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 9 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 10 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 11 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 12 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 13 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 14 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 15 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 16 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 17 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 18 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure;

FIG. 19 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure; and

FIG. 20 is a schematic cross-sectional view of a part of a displaydevice according to an embodiment of the disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings, wherein like referencenumerals refer to like elements throughout. In this regard, theembodiments may have different forms and should not be construed asbeing limited to the descriptions set forth herein. Accordingly, theembodiments are merely described below, by referring to the figures, toexplain aspects of the description. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. The terms “and” and “or” may be used in the conjunctive ordisjunctive sense and may be understood to be equivalent to “and/or.”Throughout the disclosure, the expression “at least one of a, b and c”indicates only a, only b, only c, both a and b, both a and c, both b andc, all of a, b, and c, or variations thereof.

Hereinafter, the disclosure will be described in detail by explainingembodiments of the disclosure with reference to the attached drawings,and in the description of the disclosure, certain detailed explanationsof related art are omitted when it is deemed that they may unnecessarilyobscure the essence of the disclosure.

While such terms as “first,” “second,” etc., may be used to describevarious components, such components must not be limited to the aboveterms. The above terms are used only to distinguish one component fromanother.

An expression used in the singular encompasses the expression of theplural, unless it has a clearly different meaning in the context.

Terms such as “including,” “having,” and “comprising” are intended toindicate the existence of the features disclosed in the specification,and are not intended to preclude the possibility that one or more otherfeatures may exist or may be added.

Spatially relative terms such as “below”, “beneath”, “lower”, “behind”“above”, “upper”, or “in front” or the like, may be used herein for easeof description to describe the relations between one element orcomponent and another element or component as illustrated in thedrawings. It will be understood that the spatially relative terms areintended to encompass different orientations of the device in use oroperation, in addition to the orientation depicted in the drawings. Forexample, in the case where a device illustrated in the drawing is turnedover, elements positioned “below” or “behind” another device may beplaced “above” or “in front” of another device. Accordingly, theillustrative term “below” may include both the lower and upperpositions. The device may also be oriented in other directions and thusthe spatially relative terms may be interpreted differently depending onthe orientations.

It will be understood that when a component, such as a layer, a film, aregion, or a plate, is referred to as being “on” another component, thecomponent can be directly on the other component or interveningcomponents may be present thereon.

Sizes of components in the drawings may be exaggerated for convenienceof explanation. For example, as sizes and thicknesses of components inthe drawings may be arbitrarily illustrated for convenience ofexplanation, the following embodiments are not limited thereto.

When a certain embodiment may be implemented differently, a specificprocess order may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

It will be understood that when a layer, region, or component isreferred to as being “connected to” another layer, region, or component,it can be directly connected to the other layer, region, or component orindirectly connected to the other layer, region, or component viaintervening layers, regions, or components. For example, in thespecification, when a layer, region, or component is referred to asbeing electrically connected to another layer, region, or component, itcan be directly electrically connected to the other layer, region, orcomponent or indirectly electrically connected to the other layer,region, or component via intervening layers, regions, or components.

Terms such as “overlap” may include layer, stack, face or facing,extending over, extending under, covering or partly covering or anyother suitable term as would be appreciated and understood by those ofordinary skill in the art.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” may mean within one or morestandard deviations, or within ±30%, 20%, 5% of the stated value.

Unless otherwise defined, all terms used herein (including technical andscientific terms) have the same meaning as commonly understood by thoseskilled in the art to which this disclosure pertains. It will be furtherunderstood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an ideal or excessively formal sense unlessclearly defined in the specification.

FIGS. 1A and 1B are schematic perspective views of an electronicapparatus 1 according to an embodiment of the disclosure.

Referring to FIGS. 1A and 1B, the electronic apparatus 1 may include adisplay area DA and a non-display area NDA outside the display area DA.The electronic apparatus 1 may provide an image through an array ofpixels that may be two-dimensionally arranged in the display area DA.Pixels may include first pixels P1 disposed in a first display area DA1and second pixels P2 disposed in a second display area DA2.

The electronic apparatus 1 may provide a first image by using lightemitted from the first pixels P1 disposed in the first display area DA1and a second image by using light emitted from the second pixels P2disposed in the second display area DA2. In some embodiments, the firstimage and the second image may be parts of any one image providedthrough the display area DA of the electronic apparatus 1. In someembodiments, the electronic apparatus 1 may provide the first image andthe second image that may be independent of each other.

The second display area DA2 may include a transmission area TA betweenthe second pixels P2. The transmission area TA may be an area in whichlight transmits and where no pixel may be disposed.

The non-display area NDA may be an area that does not provide an imageand is adjacent to the display area DA. For example, the non-displayarea NDA may surround (e.g., entirely surround) the display area DA. Thenon-display area NDA may be where drivers for providing electricalsignals or power to the first pixels P1 and the second pixels P2 may bedisposed. The non-display area NDA may be where a pad, to whichelectronic components or printed circuit boards may be electricallyconnected, may be disposed.

The second display area DA2 may be circular or oval in plan view, asillustrated in FIG. 1A. As another example, the second display area DA2may be polygonal such as a rectangular or bar type, as illustrated inFIG. 1B.

The second display area DA2 may be disposed inside the first displayarea DA1 (FIG. 1A) or at one side of the first display area DA1 (FIG.1B). As illustrated in FIG. 1A, the second display area DA2 may beentirely surrounded by the first display area DA1. In some embodiments,the second display area DA2 may be partially surrounded by the firstdisplay area DA1. For example, the second display area DA2 may belocated at one corner portion of the first display area DA1 and bepartially surrounded by the first display area DA1.

A ratio of the second display area DA2 to the display area DA may beless than a ratio of the first display area DA1 to the display area DA.The electronic apparatus 1, as illustrated in FIG. 1A, may include onesecond display area or two or more second display areas as the seconddisplay area DA2.

The electronic apparatus 1 may include a mobile phone, a tablet PC, alaptop, or a smart watch or smart band worn around the wrist.

FIGS. 2A to 2C are schematic cross-sectional views of a part of theelectronic apparatus 1 according to an embodiment of the disclosure.FIG. 2D is a schematic cross-sectional view of a part of the electronicapparatus 1 according to an embodiment of the disclosure.

Referring to FIGS. 2A to 2C, the electronic apparatus 1 may include thedisplay device 10 and a component 20 disposed to overlap the displaydevice 10.

The display device 10 may include a substrate 100, a display layer 200disposed on the substrate 100, a thin film encapsulation layer 300A onthe display layer 200, an input sensing layer 400, an optical functionallayer 500, an anti-reflection layer 600, and a window 700.

The component 20 may be located in the second display area DA2. Thecomponent 20 may be an electronic component that uses light or sound.For example, the electronic component may include a sensor that measuresa distance, such as a proximity sensor, a sensor that recognizes a partof the user's body, such as a fingerprint, an iris, a face, etc., asmall lamp that outputs light, or an image sensor that captures animage, such as a camera. An electronic component that uses light may uselight in various wavelength bands, such as visible light, infraredlight, and ultraviolet light. An electronic component that uses soundmay use ultrasound or sound in other frequency bands. In someembodiments, the component 20 may include sub-components such as a lightemitting part and a light receiving part. The light emitting part andthe light receiving part may have an integrated structure or aphysically separated structure in which a pair of the light emittingpart and the light receiving part constitute one component as thecomponent 20.

The substrate 100 may include glass, polymer resin, or a combinationthereof. For example, the polymer resin of the substrate 100 may includepolyether sulfone, polyacrylate, polyether imide, polyethylenenaphthalate, polyethylene terephthalate, polyphenylene sulfide,polyarylate, polyimide, polycarbonate, and/or cellulose acetatepropionate. The substrate 100 including polymer resin may be flexible,rollable, or bendable. The substrate 100 may have a multilayer structureincluding a layer including the above-described polymer resin and aninorganic layer (not shown).

The display layer 200 may be disposed on the front surface of thesubstrate 100, and a lower protection film 175 may be disposed on therear surface of the substrate 100. The lower protection film 175 may beattached on the rear surface of the substrate 100. An adhesive layer maybe provided between the lower protection film 175 and the substrate 100.As another example, the lower protection film 175 may be formed (e.g.,directly formed) on the rear surface of the substrate 100. No adhesivelayer may be provided between the lower protection film 175 and thesubstrate 100.

The lower protection film 175 may support and protect the substrate 100.The lower protection film 175 may include a first opening 175OPcorresponding to the second display area DA2. The first opening 175OP ofthe lower protection film 175 may be a concave portion formed as a partof the lower protection film 175 having been removed in a thicknessdirection (e.g. a z direction). In some embodiments, the first opening175OP of the lower protection film 175 may be formed as a part of thelower protection film 175 having been entirely removed in the thicknessdirection. The first opening 175OP may have a section of a through-holeas illustrated in FIGS. 2A and 2C. In some embodiments, the firstopening 175OP of the lower protection film 175 may have a section of ablind-hole as illustrated in FIG. 2B as a part of the lower protectionfilm 175 having been partially removed in the thickness direction.

As the lower protection film 175 may include the first opening 175OP,the transmittance of the second display area DA2, for example, the lighttransmittance of the transmission area TA, may be improved. The lowerprotection film 175 may include an organic insulating material such aspolyethylene terephthalate (PET) and/or polyimide (PI).

The display layer 200 may include pixels. Each pixel may include adisplay element and may emit red, green, or blue light. The displayelement may include an organic light-emitting diode OLED. In someembodiments, an area in the organic light-emitting diode OLED, wherelight may be emitted, may correspond to a pixel.

The display layer 200 may include a display element layer including theorganic light-emitting diode OLED that may be a display element, acircuit layer including a thin film transistor TFT electricallyconnected to the organic light-emitting diode OLED, a buffer layer 111between the display element layer and the circuit layer, and aninsulating layer IL. The thin film transistor TFT and the organiclight-emitting diode OLED electrically connected to the thin filmtransistor TFT may be disposed in each of the first display area DA1 andthe second display area DA2. The thin film transistor TFT may include asemiconductor layer Act, a gate electrode GE, a source electrode SE, anda drain electrode DE.

The second display area DA2 may include at least one transmission areaTA where the thin film transistor TFT and the organic light-emittingdiode OLED may not be disposed. The transmission area TA may be an areain which light that may be emitted from and/or proceeds toward thecomponent 20 transmits. In the display device 10, the transmittance ofthe transmission area TA may be about 30% or more, about 40% or more,about 50% or more, about 60% or more, about 70% or more, about 75% ormore, about 80% or more, about 85% or more, or about 90% or more.

A back metal layer (blocking metal layer, metal layer) BML may bedisposed between the substrate 100 and the display layer 200, forexample, between the substrate 100 and the thin film transistor TFT orbetween the substrate 100 and the buffer layer 111. The back metal layerBML may include at least one through-hole TH through which the lightemitted from or proceeding toward the component 20 may pass. Thethrough-hole TH of the back metal layer BML may be located in thetransmission area TA. A metal portion of the back metal layer BML, wherethe through-hole TH may not be formed, may prevent the diffraction oflight by a narrow gap between wirings connected to the pixel circuit PCor a narrow gap between parts of the pixel circuit PC in the seconddisplay area DA2.

The back metal layer BML may be connected to a connection line CL. Theconnection line CL may be a part of the gate electrode GE, the sourceelectrode SE, or the drain electrode DE of the thin film transistor TFT,or a line electrically connected to the gate electrode GE, the sourceelectrode SE, or the drain electrode DE. The back metal layer BML mayhave the same voltage level as that of the gate electrode GE, the sourceelectrode SE, or the drain electrode DE through the connection line CL.In an embodiment, in case the thin film transistor TFT may be a drivingthin film transistor that is described later with reference to FIG. 4,the back metal layer BML may have the same voltage level as that of agate electrode, a source electrode, or a drain electrode of the drivingthin film transistor, and the source electrode or the drain electrode ofthe driving thin film transistor may be a part of a driving voltageline. In case the back metal layer BML has a certain voltage level,deterioration of the performance of the thin film transistor TFT may beprevented or the performance of the thin film transistor TFT may beimproved.

The display layer 200 may be sealed with an encapsulation member. Insome embodiments, the encapsulation member may include the thin filmencapsulation layer 300A as illustrated in FIGS. 2A and 2B. The thinfilm encapsulation layer 300A may include at least one inorganicencapsulation layer and at least one organic encapsulation layer. In anembodiment, the thin film encapsulation layer 300A may include first andsecond inorganic encapsulation layers 310 and 330 and an organicencapsulation layer 320 therebetween.

In some embodiments, the encapsulation member may include anencapsulation substrate 300B as illustrated in FIG. 2C. Theencapsulation substrate 300B may be disposed to face the substrate 100with the display layer 200 therebetween. There may be a gap between theencapsulation substrate 300B and the display layer 200. Theencapsulation substrate 300B may include glass. A sealant may bedisposed between the substrate 100 and the encapsulation substrate 300B,and the sealant may be disposed in the non-display area NDA that ispreviously described with reference to FIG. 1A or 1B. The sealantdisposed in the non-display area NDA may surround the display area DA toprevent intrusion of moisture through a side surface.

An input sensing layer 400 may obtain coordinate information accordingto an external input, for example, a touch event of an object such as afinger or a stylus pen. The input sensing layer 400 may include a touchelectrode and trace lines connected to the touch electrode. The inputsensing layer 400 may sense an external input in a mutual-capacitance(mutual cap) method or a self-capacitance (self cap) method.

The input sensing layer 400 may be formed on the encapsulation member.As another example, the input sensing layer 400 that may be formedseparately may be bonded to the encapsulation member via an adhesivelayer such as an optical transparent adhesive OCA. In an embodiment, asillustrated in FIGS. 2A to 2C, the input sensing layer 400 may be formed(e.g., directly formed) on the thin film encapsulation layer 300A or theencapsulation substrate 300B. The adhesive layer may not be providedbetween the input sensing layer 400 and the thin film encapsulationlayer 300A or the encapsulation substrate 3006.

An optical functional layer 500 may improve optical efficiency. Forexample, the front optical efficiency and/or side visibility of thelight emitted from the organic light-emitting diode OLED may beimproved, and the diffraction of the light passing through thetransmission area TA and then proceeding toward the component 20 may bereduced or prevented.

An anti-reflection layer 600 may reduce reflectivity of light (externallight) input toward the display device 10 from the outside.

In some embodiments, the anti-reflection layer 600 may include anoptical plate having a retarder and/or a polarizer. A retarder may be ofa film type or a liquid crystal coating type and may include a λ/2retarder and/or a λ/4 retarder. A polarizer may also be a film type or aliquid crystal coating type. A film type polarizer may include astretchable synthetic resin film, and the liquid crystal coating-typepolarizer may include liquid crystals arranged in a certain array.

In some embodiments, the anti-reflection layer 600 may include a filterplate including a black matrix and color filters as illustrated in FIG.2C. A filter plate may include color filters, a black matrix, and anovercoat layer disposed in each pixel.

In some embodiments, the anti-reflection layer 600 may include adestructive interference structure. A destructive interference structuremay include a first reflective layer and a second reflective layerdisposed on different layers. First reflection light and secondreflection light respectively reflected from the first reflective layerand the second reflective layer may destructively interfere with eachother, and thus, the reflectivity of the external light may be reduced.

A window 700 may be disposed on the anti-reflection layer 600 andcoupled to the anti-reflection layer 600 through an adhesive layer suchas an optical transparent adhesive OCA. Although FIGS. 2A to 2Cillustrate that the window 700 is disposed on the anti-reflection layer600, in some embodiments, the positions of the anti-reflection layer 600and the optical functional layer 500 may be switched with each other.The window 700 may be coupled to the optical functional layer 500through an adhesive layer such as an optical transparent adhesive OCA.In some embodiments, the optical transparent adhesive OCA may be omittedbetween the window 700 and a layer under the window 700, for example, ananti-reflection layer or an optical functional layer.

One component or multiple components as the component 20 may be disposedin the second display area DA2. In case the electronic apparatus 1includes multiple components as the component 20, the electronicapparatus 1 may include multiple second display areas by as many as thenumber of components 20 as the second display area DA2. For example, theelectronic apparatus 1 may include multiple second display areas apartfrom each other as the second display areas DA2. In some embodiments,the components 20 may be disposed in one second display area as thesecond display area DA2. For example, the electronic apparatus 1 mayinclude the second display area DA2 that may be of a bar type asdescribed with reference to FIG. 1B, the components 20 may be arrangedspaced apart from each other in the length direction, for example, the xdirection of FIG. 1B, of the second display area DA2.

Although FIGS. 2A to 2C illustrate that the display device 10 mayinclude the organic light-emitting diode OLED as a display element, thedisplay device 10 of the disclosure is not limited thereto. In anotherembodiment, the display device 10 may include a light-emitting displaydevice including an inorganic material such as a micro LED, for example,an inorganic light emitting display or an inorganic display device, or adisplay device such as a quantum-dot light-emitting display device. Forexample, the light-emitting layer of the display element provided in thedisplay device 10 may include an organic material, an inorganicmaterial, quantum dots, an organic material and quantum dots, or aninorganic material and quantum dots.

Although FIGS. 2A to 2C illustrate that the display device 10 mayinclude the substrate 100 having a constant thickness, in anotherembodiment, the thickness of the substrate 100 in the transmission areaTA may be less than the thickness in other areas.

Referring to FIG. 2D, the substrate 100 may include layers, and at leastone layer of the layers may include an opening located in thetransmission area TA. For example, the substrate 100 may include a firstbase layer 101, a first barrier layer 102, a second base layer 103, anda second barrier layer 104, which may be sequentially stacked on eachother.

The first base layer 101 and the second base layer 103 each may includepolymer resin. The polymer resin may include polyethersulphone (PES),polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN),polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyimide(PI), polycarbonate, cellulose triacetate (TAC), cellulose acetatepropionate (CAP), or a combination thereof. The polymer resin may betransparent.

The first barrier layer 102 and the second barrier layer 104 each mayinclude, as a barrier layer for preventing intrusion of external foreignmaterials, a single layer or a multilayer including an inorganicinsulating material such as a silicon nitride, a silicon oxynitride,and/or a silicon oxide.

As a part of the first base layer 101 corresponding to the transmissionarea TA may be removed, the first base layer 101 may include a secondopening 101OP. Although FIG. 2D illustrates the second opening 101OP mayhave a section of a through-hole, in another embodiment, the secondopening 101OP may have a section of a blind-hole.

FIGS. 3A and 3B are schematic plan views of a display device accordingto an embodiment of the disclosure.

Referring to FIGS. 3A and 3B, the display device 10 may include an arrayof pixels disposed on the substrate 100. The pixels may include thefirst pixels P1 disposed in the first display area DA1 and the secondpixels P2 disposed in the second display area DA2.

The display area DA may include the first display area DA1 and thesecond display area DA2, and the size of the first display area DA1 andthe size of the second display area DA2 may be different from eachother. The size of the first display area DA1 may be greater than thesize of the second display area DA2.

The first pixels P1 may be two-dimensionally arranged in the firstdisplay area DA1, and the second pixels P2 may be two-dimensionallyarranged in the second display area DA2. The transmission area TA may bedisposed in the second display area DA2. The transmission area TA may bedisposed between the second pixels P2 neighboring each other.

The non-display area NDA may entirely surround the display area DA. Ascan driver or a data driver may be disposed in the non-display areaNDA. A pad 230 may be located in the non-display area NDA. The pad 230may be disposed adjacent to any one of edges of the substrate 100. Thepad 230 may be exposed without being covered by the insulating layer,and may be electrically connected to a flexible printed circuit boardFPCB. The flexible printed circuit board FPCB may electrically connect acontroller to the pad 230, and may supply signals or power transmittedfrom the controller to the pixel circuits or wires. In some embodiments,a data driver may be disposed in the flexible printed circuit boardFPCB. The pad 230 may be connected to wirings to transmit signals orvoltages of the flexible printed circuit board FPCB to the first pixelsP1 and the second pixels P2.

In another embodiment, instead of the flexible printed circuit boardFPCB, an integrated circuit may be disposed on the pad 230. Theintegrated circuit may include, for example, a data driver, and may beelectrically connected to the pad 230 via an anisotropic conductive filmcontaining a conductive ball.

Each first pixel P1 and each second pixel P2 may emit light of a certaincolor by using the organic light-emitting diode OLED of FIGS. 2A to 2C.Each organic light-emitting diode OLED may emit, for example, red,green, or blue light. Each organic light-emitting diode OLED may beconnected to a pixel circuit including a transistor and a capacitor.

FIG. 4 is a schematic circuit diagram of a pixel circuit connected to anorganic light-emitting diode of a display device according to anembodiment of the disclosure.

Referring to FIG. 4, the organic light-emitting diode OLED may beelectrically connected to the pixel circuit PC. The pixel circuit PC mayinclude a first thin film transistor T1, a second thin film transistorT2, and a storage capacitor Cst.

The second thin film transistor T2, as a switching thin film transistor,may be connected to a scan line SL and a data line DL, and may transmita data voltage, or a data signal Dm, input through the data line DL tothe first thin film transistor T1 on the basis of a switching voltage,or a switching signal Sn, input through the scan line SL. The storagecapacitor Cst may be connected to the second thin film transistor T2 anda driving voltage line PL, and may store a voltage corresponding to adifference between the voltage received from the second thin filmtransistor T2 and a first power voltage ELVDD supplied to the drivingvoltage line PL.

The first thin film transistor T1, as a driving thin film transistor,may be connected to the driving voltage line PL and the storagecapacitor Cst, and may control a driving current flowing in the organiclight-emitting diode OLED from the driving voltage line PL correspondingto a value of the voltage stored in the storage capacitor Cst. Theorganic light-emitting diode OLED may emit light having a certainluminance according to the driving current. A counter electrode, forexample, a cathode, of the organic light-emitting diode OLED may receivea second power voltage ELVSS.

Although FIG. 4 illustrates that the pixel circuit PC may include twothin film transistors and one storage capacitor, the disclosure is notlimited thereto. The number of thin film transistors and the number ofstorage capacitors may be variously changed according to the design ofthe pixel circuit PC. For example, the pixel circuit PC may includethree or more thin film transistors.

FIG. 5 is a schematic plan view of a part of a first display area of adisplay device according to an embodiment of the disclosure.

Referring to FIG. 5, the first pixels P1 may be disposed in the firstdisplay area DA1. The first pixels P1 may include a first red pixel P1r, a first green pixel P1 g, and a first blue pixel P1 b. In someembodiments, as illustrated in FIG. 5, the first red pixel P1 r, thefirst green pixel P1 g, and the first blue pixel P1 b may be disposed ina PenTile® type. For example, the first red pixels P1 r and the firstblue pixels P1 b may be alternately arranged in a first row 1N. Thefirst green pixels P1 g may be arranged in a second row 2N and be apartfrom each other at certain intervals. The first blue pixels P1 b and thefirst red pixels P1 r may be alternately arranged in an adjacent thirdrow 3N. The first green pixels P1 g may be arranged in a fourth row 4Nand be apart from each other at certain intervals. The first red andblue pixels P1 r and P1 b in the first row 1N and the first green pixelsP1 g in the second row 2N may be shifted each other. The first blue andred pixels P1 b and P1 r in the third row 3N and the first green pixelsP1 g in the fourth row 4N may be shifted each other. Therefore, thefirst red pixels P1 r and the first blue pixels P1 b may be alternatelyarranged in a first column 1M. The first green pixels P1 g may bearranged in a second column 2M and be apart from each other at certainintervals. The first blue pixels P1 b and the first red pixels P1 r maybe alternately arranged in a third column 3M. The first green pixels P1g may be arranged in a fourth column 4M and be apart from each other atcertain intervals. Such pixel arrangement may be repeated up to an Mthcolumn. The pixel arrangement structure described above may be expresseddifferently as follows: the first red pixels P1 r are arranged at firstand third vertices facing each other from among the vertices of avirtual rectangle VS having a center point of the first green pixel P1 gas a center point of a rectangle, and the first blue pixels P1 b arearranged at second and fourth vertices that are the other vertices. Inthis case, the virtual rectangle VS may be modified in various forms,such as a rectangle, a rhombus, and a square Such a pixel arrangementstructure may be referred to as a PenTile matrix structure or a PenTilestructure, and high resolution may be implemented with a small number ofpixels by applying a rendering driving that expresses colors by sharingadjacent pixels. In another embodiment, the first red pixel P1 r, thefirst green pixel P1 g, and the first blue pixel P1 b may be disposed ina stripe type.

A first red pixel P1 r, a first green pixel P1 g, and a first blue pixelP1 b may have sizes or widths different from one another. For example,the first blue pixel P1 b may be larger than the first red pixel P1 rand the first green pixel P1 g, and the first red pixel P1 r may belarger than the first green pixel P1 g. In some embodiments, the firstgreen pixel P1 g may be rectangular, and the first green pixels P1 gthat neighbor each other may extend in different directions.

FIG. 6 is a schematic plan view of a second display area of a displaydevice according to an embodiment of the disclosure.

Referring to FIG. 6, the second pixels P2 may be disposed in the seconddisplay area DA2. The second pixels P2 may include a second red pixel P2r, a second green pixel P2 g, and a second blue pixel P2 b. In someembodiments, the second red pixel P2 r, the second green pixel P2 g, andthe second blue pixel P2 b may be disposed in a pentile type. In anotherembodiment, the second red pixel P2 r, the second green pixel P2 g, andthe second blue pixel P2 b may be disposed in a stripe type.

The transmission area TA may be disposed adjacent to the second pixelsP2. For example, the transmission area TA may be disposed between thesecond pixels P2. The transmission areas TA, as illustrated in FIG. 6,may be arranged in the x direction, the y direction and/or a directionoblique to the x and y directions adjacent to each other as illustrated.

The back metal layer BML may be disposed in the second display area DA2.The back metal layer BML may include through-holes corresponding to thetransmission area TA, and in this regard, FIG. 6 illustrates a firstthrough-hole TH1 and a second through-hole TH2. A metal part may bebetween the first through-hole TH1 and the second through-hole TH2, andthe second red pixel P2 r, the second green pixel P2 g, and the secondblue pixel P2 b may be disposed on the metal part.

The first through-hole TH1 and the second through-hole TH2 may be apartfrom each other, but may be disposed adjacent to each other. The firstthrough-hole TH1 and the second through-hole TH2 may be different fromeach other in terms of shape, pattern, size, and/or width (also referredto herein as shapes and/or sizes). Shapes being different from eachother may mean that the condition of similarity in geometry, forexample, the Euclidean geometry, may not be satisfied. For example, incase one of the first through-hole TH1 and the second through-hole TH2may be magnified or reduced and then overlapped with the other, if thefirst through-hole TH1 and the second through-hole TH2 do not match100%, it may be stated that the shape of the first through-hole TH1 andthe shape of the second through-hole TH2 may be different.

The first through-hole TH1 may include corner parts disposed in a firstdirection, for example, the y direction, and a second direction, forexample, the x direction, crossing the first direction from a firstcenter O1 of the first through-hole TH1. For example, the firstthrough-hole TH1 may include four corner parts (hereinafter, referred toas the first to fourth corner parts C11, C12, C13, and C14) disposed inthe left, right, up, and down directions from the first center O1.

A side edge E1 between two neighboring corner parts of the firstthrough-hole TH1 may be largely curved. Each side edge E1 between thefirst corner part C11 and the second corner part C12, between the secondcorner part C12 and the third corner part C13, between the third cornerpart C13 and the fourth corner part C14, and between the fourth cornerpart C14 and the first corner part C11 may be largely curved. The sideedge E1 being largely curved may be distinguished from a structure thatextends in the x direction and suddenly bents in the y direction, forexample, a structure that may be bent about 90°.

The edges of the first through-hole TH1 may include an uneven part. Forexample, the edges of the first through-hole TH1 may include an unevenpart with irregular unevenness. For example, each side edge E1 betweenthe first corner part C11 and the third corner part C13, between thesecond corner part C12 and the third corner part C13, between the secondcorner part C12 and the fourth corner part C14, and between the fourthcorner part C14 and the first corner part C11 may include irregularunevenness. In some embodiments, the side edge E1 of the firstthrough-hole TH1 may be largely curved (or macroscopically) and mayinclude irregular unevenness locally (or microscopically).

The second through-hole TH2 may include corner parts disposed in thefirst direction, for example, the y direction, and the second direction,for example, the x direction, crossing the first direction, from asecond center O2 of the second through-hole TH2. For example, the secondthrough-hole TH2 may include four corner parts (hereinafter, referred toas the fifth to eighth corner parts C21, C22, C23, and C24) disposed inthe left, right, up, and down directions from the second center O2.

The edges of the second through-hole TH2 may include an uneven part. Forexample, the edges of the second through-hole TH2 may include irregularunevenness. For example, each side edge E2 between the fifth corner partC21 and the seventh corner part C23, between the sixth corner part C22and the seventh corner part C23, between the sixth corner part C22 andthe eighth corner part C24, and between the eighth corner part C24 andthe fifth corner part C21 may include irregular unevenness. In someembodiments, the side edge E2 of the second through-hole TH2 may belargely curved (or macroscopically) and may include irregular unevennesslocally (or microscopically).

A first width W1 of the first through-hole TH1 may be different from asecond width W2 of the second through-hole TH2. For example, the firstwidth (maximum width) W1 of the first through-hole TH1 passing the firstcenter O1 may be greater than the second width (maximum width) W2 of thesecond through-hole TH2 passing the second center O2. The first width W1may be about 200 μm to about 300 μm or about 250 μm to about 300 μm. Inan embodiment, the first width W1 may be about 270 μm.

Multiple first through-holes as the first through-hole TH1 may bearranged to surround the second through-hole TH2. In this respect, FIG.6 illustrates that four first through-holes TH1 may be disposed aroundone second through-hole TH2. In some embodiments, the firstthrough-holes TH1 may be arranged around the second through-hole TH2such that each of the side edge E1 of the first through-hole TH1 and theside edge E2 of the second through-hole TH2 may be adjacent to eachother. The corner parts of the first through-hole TH1 and the cornerparts of the second through-hole TH2 may be disposed adjacent to eachother. For example, the two neighboring corner parts of the secondthrough-holes TH2, and the two neighboring corner parts of the firstthrough-holes TH1 may be disposed adjacent to each other.

According to the embodiment described with reference to FIG. 6, thefirst through-hole TH1 may be approximately a cross type and the secondthrough-hole TH2 may be approximately a rhombus type, and the firstthrough-hole TH1 and/or the second through-hole TH2 may be variouslychanged as described below with reference to FIGS. 7 to 19.

FIG. 7 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure.

Referring to FIG. 7, the back metal layer BML may include the firstthrough-hole TH1 and the second through-hole TH2, which may be differentin terms of shape and/or size. A metal part BML-M of the back metallayer BML may overlap the second pixels as described above withreference to FIG. 6.

The first through-hole TH1 may include corner parts, for example, thefirst to fourth corner parts C11, C12, C13, and C14, which may bedisposed in different directions with respect to the first center O1.The side edge E1 between two neighboring corner parts of the firstthrough-hole TH1 may be largely curved and may have locally irregularunevenness. According to the embodiment illustrated in FIG. 7, a corneredge CE1 of each of the first to fourth corner parts C11, C12, C13, andC14 of the first through-hole TH1 may include irregular unevenness.

The second through-hole TH2 may include corner parts, for example, fifthto eighth corner parts C21, C22, C23, and C24, disposed in differentdirections with respect to the second center O2. Unlike the secondthrough-hole TH2 described with reference to FIG. 6, the side edge E2 ofthe second through-hole TH2 of FIG. 7 may be largely curved. The secondthrough-hole TH2 may be largely or macroscopically curved and mayinclude irregular unevenness locally or microscopically. Although thesecond through-hole TH2 may be approximately a cross type, the shape ofthe second through-hole TH2 may be different from that of the firstthrough-hole TH1. For example, while the second through-hole TH2 has across shape in which the width of each of the fifth to eighth cornerparts C21, C22, C23, and C24 thereof decreases in a direction away fromthe second center O2, the first through-hole TH1 has a cross shape,which may be different in a detailed shape, in which the width of eachof the first to fourth corner parts C11, C12, C13, and C14 may be acertain width, for example, about 70 μm to about 90 μm.

The first width of the first through-hole TH1 may be greater than thesecond width of the second through-hole TH2. Multiple firstthrough-holes as the first through-hole TH1 may be arranged around thesecond through-hole TH2 as a center. For example, the side edge E1 ofthe first through-hole TH1 and the side edge E2 of the secondthrough-hole TH2 may be disposed adjacent to each other, and/or thecorner parts of the first through-hole TH1 and the corner parts of thesecond through-hole TH2 may be disposed adjacent to each other, asdescribed with reference to FIG. 6.

FIGS. 8 to 10 are schematic plan views of excerpts of a metal layer of adisplay device according to embodiments of the disclosure.

Referring to FIGS. 8 and 9, the back metal layer BML may include thefirst through-hole TH1 and the second through-hole TH2 having differentshapes and/or sizes. The features regarding the metal part BML-M of theback metal layer BML and the structure and arrangement of the firstthrough-hole TH1 and the second through-hole TH2 may be the same asthose described with reference to FIGS. 6 and 7.

Unlike the corner edge CE1 of each of the first to fourth corner partsC11, C12, C13, and C14 of the first through-hole TH1 described withreference to FIGS. 6 and 7 extending largely in the x direction or the ydirection, the corner edge CE1 of each of the first to fourth cornerparts C11, C12, C13, and C14 of the first through-hole TH1 of FIGS. 8and 9 may be arranged along a virtual line passing the first center O1in the x direction or the y direction and may be curved to have acertain radius of curvature

The first through-hole TH1 of FIGS. 8 and 9 may include the side edge E1between adjacent corner parts, and the side edge E1 may be largelycurved and may include an uneven part (e.g., locally irregularunevenness) as described above with reference to FIG. 6. While the sideedge E1 of the first through-hole TH1 illustrated in FIG. 9 may belargely curved, a degree of curve, for example, a radius of curvature,may be less than a radius of curvature of the side edge E1 of the firstthrough-hole TH1 of FIG. 8.

While the side edge E1 of the first through-hole TH1 of FIGS. 8 and 9includes locally irregular unevenness, in another embodiment, referringto FIG. 10, the side edge E1 of the first through-hole TH1 may include asmooth curve in plan view. The corner edge CE1 of each corner part ofthe first through-hole TH1 may also include a smooth curve similar tothe side edge E1.

The side edge E2 and/or a corner edge CE2 of the second through-hole TH2may include an uneven part (e.g., irregular unevenness), as illustratedin FIGS. 8 and 9, or may include a smooth curve as illustrated in FIG.10.

FIGS. 11 and 12 are schematic plan views of excerpts of a metal layer ofa display device according to an embodiment of the disclosure.

Referring to FIG. 11, the back metal layer BML may include the firstthrough-hole TH1 and the second through-hole TH2 having different shapesand/or sizes. Features regarding the metal part BML-M of the back metallayer BML and the structure and arrangement of the first through-holeTH1 and the second through-hole TH2 may be the same as those describedwith reference to FIGS. 6 and 7.

Each of the first to fourth corner parts C11, C12, C13, and C14 of thefirst through-hole TH1 may include a fine protruding portion ph, and theside edge E1 of the first through-hole TH1 may include a fine concaveportion ch. The fine concave portion ch of the first through-hole TH1may be a fine protrusion of the metal part BML-M of the back metal layerBML. As the first through-hole TH1 may be defined by an edge of themetal part BML-M, a fine protrusion of the metal part BML-M may be thefine concave portion ch of the first through-hole TH1. The term “fine”in the fine protruding portion ph and the fine concave portion ch maymean that the diameter or width of the fine protruding portion ph andthe diameter or width of the fine concave portion ch may be less aboutten times or more than the width of the first through-hole TH1 or thewidth of the second through-hole TH2. For example, a diameter or widths1 of the fine protruding portion ph and a diameter or width s2 of thefine concave portion ch may be about 1 μm to about 20 μm.

The second through-hole TH2 may include the fifth to eighth corner partsC21, C22, C23, and C24, and the second through-hole TH2, as illustratedin FIG. 11, unlike the first through-hole TH1, may not include a fineconcave portion and/or a fine protruding portion. In another embodiment,the second through-hole TH2, similar to the first through-hole TH1, mayinclude a fine concave portion and/or a fine protruding portion.

The second through-hole TH2, as illustrated in FIG. 11, may have astructure of a left-right symmetry and/or an up-down symmetry withrespect to a line passing the second center O2 as a center. As anotherexample, the second through-hole TH2, as illustrated in FIG. 12, may nothave a structure of a left-right symmetry and/or an up-down symmetry.

The metal part BML-M of the back metal layer BML may be between thefirst through-hole TH1 and the second through-hole TH2, as illustratedin FIGS. 11 and 12, and the metal part BML-M of the back metal layer BMLmay include a fine hole FH. The fine hole FH may be between the firstthrough-hole TH1 and the second through-hole TH2. Although FIG. 12illustrates that the fine hole FH may be located adjacent to each of thecorner part of the first through-hole TH1 and the corner part of thesecond through-hole TH2, in another embodiment, the fine hole FH may bebetween the side edge E1 of the first through-hole TH1 and the side edgeE2 of the second through-hole TH2.

The term “fine” in the fine hole FH may mean that the diameter or widthof the fine hole FH may be less about ten times or more, particularly,about twenty times or more, than the width of the first through-hole TH1or the width of the second through-hole TH2. For example, the diameteror width of the fine hole FH may be about 1 μm to about 10 μm.

FIGS. 13 to 15 each are a schematic plan view of an excerpt of a metallayer of a display device according to an embodiment of the disclosure.

Referring to FIGS. 13 and 14, the back metal layer BML may include thefirst through-hole TH1 and the second through-hole TH2 having differentshapes and/or sizes. The features regarding the metal part BML-M of theback metal layer BML and the structure and arrangement of the firstthrough-hole TH1 and the second through-hole TH2 may be the same asthose described with reference to FIGS. 6 and 7. In the embodimentsdescribed with reference to FIG. 6 to FIG. 12, the first through-holeTH1 may be approximately a cross type, whereas the first through-holeTH1 of FIGS. 13 to 15 may be approximately a rhombus type.

Referring to FIG. 13, the first through-hole TH1 may include the firstto fourth corner parts C11, C12, C13, and C14, which may be disposed inthe left, right, up, and down directions from the first center O1, andthe second through-hole TH2 may include the fifth to eighth corner partsC21, C22, C23, and C24, which may be disposed in the left, right, up,and down directions from the second center O2. The first through-holeTH1 and the second through-hole TH2 may be disposed neighboring eachother. For example, as described above, the side edge E1 of the firstthrough-hole TH1 and the side edge E2 of the second through-hole TH2 maybe disposed adjacent to each other, and the corner parts of the firstthrough-hole TH1 and the corner parts of the second through-hole TH2 maybe disposed adjacent to each other.

In the first through-hole TH1 and the second through-hole TH2 of FIG.14, as described above with reference to FIG. 13, each may includecorner parts, and at least one of the first through-hole TH1 and thesecond through-hole TH2 may include a fine protruding portion and/or aconcave portion.

In an embodiment, as illustrated in FIG. 14, the first through-hole TH1may include the fine protruding portion ph located at the corner part,and the second through-hole TH2 may include the concave portion(hereinafter, the fine concave portion ch) located at the side edge E2.The fine concave portion ch of the second through-hole TH2 may be aportion of the metal part BML-M of the back metal layer BML protrudingtoward the second through-hole TH2, as described above. The diameter orwidth s1 of the fine protruding portion ph and the diameter or width s2of the fine concave portion ch may be selected within a range of about 1μm to about 20 μm.

Although FIG. 14 illustrates that the side edge E1 of the firstthrough-hole TH1 and the side edge E2 of the second through-hole TH2each include an uneven part (e.g., irregular unevenness), in anotherembodiment, at least one of the side edge E1 of the first through-holeTH1 and the side edge E2 of the second through-hole TH2 may include asmooth curve. In an embodiment, FIG. 15 illustrates that the side edgeE1 of the first through-hole TH1 includes a smooth curve and the sideedge E2 of the second through-hole TH2 includes an uneven part (e.g.,irregular unevenness).

FIGS. 16 to 18 are schematic plan views of an excerpt of a metal layerof a display device according to an embodiment of the disclosure.

Referring to FIGS. 16 and 17, the first through-hole TH1 and/or thesecond through-hole TH2 may include the fine protruding portion ph andthe fine concave portion ch.

Referring to FIGS. 16 and 17, the corner parts of the first through-holeTH1 may include the fine protruding portion ph and the fine concaveportion ch, and the second through-hole TH2 may include the fineprotruding portion ph and the fine concave portion ch. The side edge E2of the second through-hole TH2, as illustrated in FIG. 16, may includefine protruding portions as the fine protruding portion ph and the fineconcave portion ch between the neighboring fine protruding portions ph.

The fine hole FH may be disposed between the first through-hole TH1 andthe second through-hole TH2, as illustrated in FIG. 17. For example, thefine hole FH may be disposed adjacent to each of the four corner partsof the second through-hole TH2.

In FIGS. 16 and 17, the first through-hole TH1 and the secondthrough-hole TH2 may have a left-right symmetry and/or an up-downsymmetry with respect to each center. In another embodiment, referringto FIG. 18, the first through-hole TH1 and the second through-hole TH2may not have a left-right symmetry and/or an up-down symmetry withrespect to each center. For example, the shapes of at least two cornerparts selected from the first to fourth corner parts C11, C12, C13, andC14 of the first through-hole TH1 may be different from one another.

In an embodiment, as illustrated in FIG. 18, the shapes of the first tofourth corner parts C11, C12, C13, and C14 of the first through-hole TH1may be different from one another. Although each of the first to fourthcorner parts C11, C12, C13, and C14 may include the fine protrudingportion ph and/or the fine concave portion ch, specific arrangements,locations, and/or widths thereof may be different from one another, andaccordingly, the shapes of the first to fourth corner parts C11, C12,C13, and C14 may be different from one another.

Similarly, the shapes of the fifth to eighth corner parts C21, C22, C23,and C24 of the second through-hole TH2 may be different from oneanother. One or more of the fifth to eighth corner parts C21, C22, C23,and C24 may include the fine protruding portion ph and/or the fineconcave portion ch. The shapes of the fifth to eighth corner parts C21,C22, C23, and C24 may be different from one another according to whetherthe fifth to eighth corner parts C21, C22, C23, and C24 include the fineprotruding portion ph and the fine concave portion ch, or according to aspecific arrangement in case the fifth to eighth corner parts C21, C22,C23, and C24 include the fine protruding portion ph or the fine concaveportion ch.

According to the embodiments described with reference to FIGS. 6 to 18,the side edge E1 of the first through-hole TH1 and the side edge E2 ofthe second through-hole TH2 may be disposed adjacent to each other, andthe corner parts of the first through-hole TH1 and the corner parts ofthe second through-hole TH2 may be disposed adjacent to each other.However, the disclosure is not limited thereto. In another embodiment,in the first through-hole TH1 and the second through-hole TH2, the sideedge E1 of the first through-hole TH1 and the corner parts of the firstthrough-hole TH1 may be disposed adjacent to each other.

FIG. 19 is a schematic plan view of an excerpt of a metal layer of adisplay device according to an embodiment of the disclosure.

According to the embodiments described with reference to FIGS. 6 to 18,the first through-holes TH1 apart from each other may be arranged tosurround the second through-hole TH2, but the disclosure is not limitedthereto. Referring to FIG. 19, the second through-hole TH2 may beentirely surrounded by the first through-hole TH1.

The first through-hole TH1 may have a mesh structure extending in thefirst direction, for example, the y direction, and the second direction,for example, the x direction, and multiple metal parts BML-M may bespaced apart from each other in an island type. The second through-holeTH2 may be apart from the first through-hole TH1 with the metal partBML-M therebetween, and the second through-hole TH2 may be disposed at alocation corresponding to the center of the metal part BML-M. The sideedge of each of the first through-hole TH1 and/or the secondthrough-hole TH2 may have an uneven part (e.g., irregular unevenness),as described above.

The back metal layer BML having the structure according to theembodiments described with reference to FIGS. 6 to 19 may reduce orprevent diffraction of light incident on a component through the backmetal layer BML.

A line spread function (LSF) may be checked by irradiating a line lightsource to the back metal layer BML having the above-described structure.In a graph regarding data related to the above-described LSF, forexample, light intensity to a location, a ratio of the second peak tothe first peak was searched for, and the value was found to be about 5%or less, and thus it may be checked that the diffraction of lightincident on a component through the back metal layer BML having theabove-described structure may be reduced or prevented. It may be checkedthat the ratio of the second peak to the first peak of the LSF beingabout 5% or less may be about 50% when converted to a modulationtransfer function (MTF).

FIG. 20 is a schematic cross-sectional view of a part of a displaydevice according to an embodiment of the disclosure.

Referring to FIG. 20, the substrate 100 may have a multilayer structure.The substrate 100 may include the first base layer 101, the firstbarrier layer 102, the second base layer 103 and the second barrierlayer 104, which may be sequentially stacked on each other, and detailedmaterials thereof may be the same as those described above withreference to FIG. 2D. Although FIG. 20 illustrates that the substrate100 has the above-described multilayer structure, in another embodiment,the substrate 100 may be formed in a single layer like a glass material.

The buffer layer 111 may reduce or prevent the intrusion of foreignmaterials, moisture, or external air from the lower portion of thesubstrate 100 and may provide a planarized surface on the substrate 100.The buffer layer 111 may include an inorganic insulating material suchas a silicon oxide, a silicon oxynitride, and a silicon nitride, and mayhave a single layer or multilayer structure including theabove-described material.

The back metal layer BML may be disposed between the substrate 100 andthe buffer layer 111. The back metal layer BML may include thethrough-hole TH corresponding to the transmission area TA. The backmetal layer BML may include conductive metal such as aluminum (Al),platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au),nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca),molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu). Theback metal layer BML may have a flat structure as described above withreference to FIGS. 6 to 19, and in FIG. 20, the through-hole TH of theback metal layer BML may correspond to the first through-hole TH1 or thesecond through-hole TH2, which is described with reference to FIGS. 6 to19.

The back metal layer BML may be electrically connected to the connectionline CL. The connection line CL may be electrically connected to a gateelectrode, a source electrode, or a drain electrode of the thin filmtransistor TFT, or electrically connected to any one capacitor plate ofthe storage capacitor Cst that is described later. As another example,the connection line CL may be electrically connected to the drivingvoltage line PL of FIG. 4. The back metal layer BML may be electricallyconnected by the connection line CL to the gate electrode, the sourceelectrode, or the drain electrode of the thin film transistor TFT, toany one capacitor plate of the storage capacitor Cst, or to the drivingvoltage line PL. The back metal layer BML connected to the connectionline CL may protect the thin film transistor TFT from the externalstatic electricity or enhance the performance of the thin filmtransistor TFT.

The pixel circuit PC including the thin film transistor TFT and thestorage capacitor Cst may be disposed on the buffer layer 111. The thinfilm transistor TFT may include the semiconductor layer Act, the gateelectrode GE overlapping a channel region of the semiconductor layerAct, and the source electrode SE and the drain electrode DE respectivelyconnected to a source region and a drain region of the semiconductorlayer Act. A gate insulating layer 112 may be provided between thesemiconductor layer Act and the gate electrode GE, and a firstinterlayer insulating layer 113 and a second interlayer insulating layer115 may be disposed between the gate electrode GE and the sourceelectrode SE or between the gate electrode GE and the drain electrodeDE.

The storage capacitor Cst may be disposed overlapping the thin filmtransistor TFT. The storage capacitor Cst may include a first capacitorplate Cst1 and a second capacitor plate Cst2 that overlap each other. Insome embodiments, the gate electrode GE of the thin film transistor TFTmay include the first capacitor plate Cst1 of the storage capacitor Cst.The first interlayer insulating layer 113 may be disposed between thefirst capacitor plate Cst1 and the second capacitor plate Cst2.

The semiconductor layer Act may include polysilicon. In someembodiments, the semiconductor layer Act may include amorphous silicon.In some embodiments, the semiconductor layer Act may include an oxide ofat least one material selected from the group consisting of indium (In),gallium (Ga), stannum (Sn), zirconium (Zr), vanadium (V), hafnium (Hf),cadmium (Cd), germanium (Ge), Cr, Ti, and zinc (Zn). The semiconductorlayer Act may include the channel region, and the source region and thedrain region where impurities may be doped.

The gate insulating layer 112 may include an inorganic insulatingmaterial such as a silicon oxide, a silicon oxynitride, and a siliconnitride, and may have a single layer or multilayer structure includingthe above-described material.

The gate electrode GE or the first capacitor plate Cst1 may include alow resistance conductive material such as Mo, Al, Cu, and/or Ti, andmay have a single layer or multilayer structure having theabove-described material.

The first interlayer insulating layer 113 may include an inorganicinsulating material such as a silicon oxide, a silicon oxynitride, and asilicon nitride, and may have a single layer or multilayer structureincluding the above-described material.

The second capacitor plate Cst2 may include Al, Pt, Pd, Ag, Mg, Au, Ni,Nd, Ir, Cr, Ca, Mo, Ti, W, and/or Cu, and may have a single layer ormultilayer structure including the above-described material.

The second interlayer insulating layer 115 may include an inorganicinsulating material such as a silicon oxide, a silicon oxynitride, and asilicon nitride, and may have a single layer or multilayer structureincluding the above-described material.

The source electrode SE or the drain electrode DE may include Al, Pt,Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Ca, Mo, Ti, W, and/or Cu, and may have asingle layer or multilayer structure including the above-describedmaterial. For example, the source electrode SE or the drain electrode DEmay have a triple layer structure of a titanium layer/an aluminumlayer/a titanium layer.

A planarization insulating layer 117 may include a material that may bedifferent from the material of at least one inorganic insulating layer116 disposed under the planarization insulating layer 117, for example,the gate insulating layer 112, the first interlayer insulating layer113, and the second interlayer insulating layer 115. The planarizationinsulating layer 117 may include an organic insulating material such asacryl, benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO),or a combination thereof.

A pixel electrode 221 may be formed on the planarization insulatinglayer 117. The pixel electrode 221 may be electrically connected to thethin film transistor TFT via a contact hole formed in the planarizationinsulating layer 117.

The pixel electrode 221 may include a reflective film including Ag, Mg,Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof. The pixelelectrode 221 may include the reflective film including theabove-described material and a transparent conductive film disposedabove and/or below the reflective film. The transparent conductive filmmay include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide(ZnO), indium oxide (In₂O₃), indium gallium oxide (IGO), aluminum zincoxide (AZO), or a combination thereof. In an embodiment, the pixelelectrode 221 may have a tri-layer structure of an ITO layer/an Aglayer/an ITO layer that may be sequentially stacked on each other.

A pixel defining film 119 may cover the edge of the pixel electrode 221,and may include a through-hole 119TH that exposes the center of thepixel electrode 221. The pixel defining film 119 may include an organicinsulating material such as BCB, polyimide, HMDSO, or a combinationthereof. The through-hole 119TH of the pixel defining film 119 maydefine an emission area EA, and red, green, or blue light may be emittedthrough the emission area EA. The area or width of the emission area EAmay define the area or width of a pixel.

A spacer 121 may be formed on the pixel defining film 119. The spacer121 may prevent layers below the spacer 121 from being damaged by a maskin a process of forming an intermediate layer 222 that is describedlater. The spacer 121 and the pixel defining film 119 may include a samematerial.

The intermediate layer 222 may include a light-emitting layer 222 boverlapping the pixel electrode 221. The light-emitting layer 222 b mayinclude an organic material. The light-emitting layer 222 b may includea polymer organic material or a low molecular weight organic materialthat emits light of a certain color. The light-emitting layer 222 b maybe formed through a deposition process using a mask, as described above.

A first functional layer 222 a and a second functional layer 222 c maybe disposed above and/or below the light-emitting layer 222 b.

The first functional layer 222 a may be a single layer or multilayer.For example, in case the first functional layer 222 a may be formed of apolymer material, the first functional layer 222 a may be formed ofpoly-(3,4)-ethylene-dihydroxy thiophene (PEDOT) or polyaniline (PANI),as a hole transport layer (HTL) that may be a single layer structure. Incase the first functional layer 222 a may be formed of a low molecularweight material, the first functional layer 222 a may include a holeinjection layer (HIL) and the HTL.

The second functional layer 222 c may be optional. For example, in casethe first functional layer 222 a and the light-emitting layer 222 b maybe formed of a polymer material, the second functional layer 222 c maybe formed. The second functional layer 222 c may be a single layer ormultilayer. The second functional layer 222 c may include an electrontransport layer (ETL) and/or an electron injection layer (EIL).

Each of the first functional layer 222 a and the second functional layer222 c may be formed as a single body to largely cover the display area.As illustrated in FIG. 20, the first functional layer 222 a and thesecond functional layer 222 c may be integrally formed across thedisplay area.

A counter electrode 223 may be formed of a conductive material having arelatively low work function. For example, the counter electrode 223 mayinclude a (semi-) transparent layer including Ag, Mg, Al, Ni, Cr,lithium (Li), Ca, or an alloy thereof. As another example, the counterelectrode 223 may further include a layer such as ITO, IZO, ZnO, orIn₂O₃ on the (semi-) transparent layer including the above-describedmaterial. In an embodiment, the counter electrode 223 may include Ag,Mg, or a combination thereof. The counter electrode 223 may include afourth hole 223H located in the transmission area TA, and may beintegrally formed across the display area.

A stack structure of the pixel electrode 221, the intermediate layer222, and the counter electrode 223, which may be sequentially stacked oneach other, may form a light-emitting diode, for example, the organiclight-emitting diode OLED. The display layer 200 including the pixelcircuit PC, the insulating layers, and the organic light-emitting diodeOLED may be covered by the thin film encapsulation layer 300A.

The thin film encapsulation layer 300A may include the organicencapsulation layer 320 between the first and second inorganicencapsulation layers 310 and 330.

The first and second inorganic encapsulation layers 310 and 330 each mayinclude one or more inorganic insulating materials. The inorganicinsulating material may include aluminum oxide, titanium oxide, tantalumoxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and/orsilicon oxynitride. The first and second inorganic encapsulation layers310 and 330 may be formed by a chemical vapor deposition method.

The organic encapsulation layer 320 may include a polymer-basedmaterial. The polymer-based material may include acryl-based resin,epoxy-based resin, polyimide, polyethylene, or a combination thereof.For example, the organic encapsulation layer 320 may include acryl-basedresin, for example, polymethyl methacrylate or polyacryl acid. Theorganic encapsulation layer 320 may be formed by curing a monomer orcoating a polymer.

As the second display area DA2 may include the transmission area TA,FIG. 20 illustrates that two pixel circuits PC and two organiclight-emitting diodes OLED may be disposed adjacent to each other withthe transmission area TA therebetween.

The insulating layer IL on the substrate 100, for example, at least oneof the inorganic insulating layer 116 and the planarization insulatinglayer 117, and the pixel defining film 119 may include a holecorresponding to the transmission area TA. At least one inorganicinsulating layer 116 may include any one or more selected from the gateinsulating layer 112, the first interlayer insulating layer 113, and thesecond interlayer insulating layer 115.

At least one of a first hole 116H of the inorganic insulating layer 116,a second hole 117H of the planarization insulating layer 117, and athird hole 119H of the pixel defining film 119 may overlap each other inthe transmission area TA. The counter electrode 223 may include thefourth hole 223H located in the transmission area TA, and the fourthhole 223H may overlap the first hole 116H, the second hole 117H, and thethird hole 119H. The first hole 116H may have a shape of a through-holethat penetrates a stack body of the gate insulating layer 112, the firstinterlayer insulating layer 113, and the second interlayer insulatinglayer 115 or a shape of a blind-hole in which the above-described stackbody may be partially removed in a thickness direction. Each of thesecond hole 117H, the third hole 119H, and the fourth hole 223H may havethe shape of a through-hole.

Each of the buffer layer 111 and the second barrier layer 104 may notinclude a hole located in the transmission area TA. For example, asillustrated in FIG. 20, the buffer layer 111 and the second barrierlayer 104 may cover the transmission area TA. In some embodiments, thebuffer layer 111 and/or the second barrier layer 104 may include a holelocated in the transmission area TA.

The sizes or widths of the first hole 116H, the second hole 117H, thethird hole 119H, and the fourth hole 223H may be different from eachother. Although FIG. 20 illustrates that the width of the first hole116H may be substantially the same as the width of the through-hole THof the back metal layer BML, the disclosure is not limited thereto. Inanother embodiment, the width of the first hole 116H may be greater orless than the width of the through-hole TH of the back metal layer BML.

Although FIG. 20 illustrates that the thin film encapsulation layer 300Amay be disposed on the organic light-emitting diode OLED, in anotherembodiment, the encapsulation substrate 300B of FIG. 2C may be disposedon the organic light-emitting diode OLED. Although FIG. 20 illustrates asectional structure in the second display area DA2, the organiclight-emitting diode OLED and the pixel circuit PC electricallyconnected to the organic light-emitting diode OLED may be disposed inthe first display area DA1, and the structure may be the same as thestructure of the organic light-emitting diode OLED and the pixel circuitPC, which are described with reference to FIG. 20.

The embodiments of the disclosure may provide a display panel which mayprovide a high quality image, and the diffraction of light that acomponent receives may be prevented. The effect is exemplary, and thescope of the disclosure is not limited thereby.

It should be understood that embodiments described herein should beconsidered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments. While one or more embodiments have beendescribed with reference to the figures, it will be understood by thoseof ordinary skill in the art that various changes in form and detailsmay be made therein without departing from the spirit and scope asdefined by the following claims, including any equivalents.

What is claimed is:
 1. A display device comprising: pixel circuitsdisposed on a substrate, each of the pixel circuits comprising atransistor and a storage capacitor; display elements electricallyconnected to the pixel circuits; and a metal layer disposed between thesubstrate and the pixel circuits, the metal layer comprisingthrough-holes, wherein the through-holes of the metal layer comprise: afirst through-hole; and a second through-hole disposed adjacent to thefirst through-hole.
 2. The display device of claim 1, wherein the metallayer comprises a metal part between the first through-hole and thesecond through-hole, and the metal part overlaps the pixel circuits andthe display elements.
 3. The display device of claim 1, wherein thefirst through-hole has a shape, a size, or a width which is differentfrom that of the second through-hole.
 4. The display device of claim 1,wherein at least one of the first through-hole and the secondthrough-hole comprises corner parts disposed in different directionsfrom a center.
 5. The display device of claim 4, wherein at least one ofthe first through-hole and the second through-hole comprises a side edgebetween adjacent corner parts, and the side edge is curved.
 6. Thedisplay device of claim 5, wherein the side edge comprises an unevenpart. The display device of claim 4, wherein the first through-holecomprises four corner parts disposed in four different directions from afirst center, the second through-hole comprises four corner partsdisposed in four different directions from a second center, and one ormore corner parts of the first through-hole and one or more corner partsof the second through-hole are adjacent to each other.
 8. The displaydevice of claim 1, wherein the first through-hole entirely surrounds thesecond through-hole.
 9. The display device of claim 1, wherein at leastone of the first through-hole and the second through-hole comprises aprotruding portion.
 10. The display device of claim 1, wherein the metallayer further comprises a fine hole disposed between the firstthrough-hole and the second through-hole.
 11. An electronic apparatuscomprising: a display device comprising at least one transmission area;and a component disposed below the at least one transmission area,wherein the display device comprises: pixel circuits disposed on asubstrate, each of the pixel circuits comprising a transistor and astorage capacitor; display elements electrically connected to the pixelcircuits; and a metal layer disposed between the substrate and the pixelcircuits, the metal layer comprising a first through-hole and a secondthrough-hole.
 12. The electronic apparatus of claim 11, wherein themetal layer comprises a metal part between the first through-hole andthe second through-hole, and the metal part overlaps the pixel circuitsand the display elements.
 13. The electronic apparatus of claim 12,wherein the metal part comprises a fine hole.
 14. The electronicapparatus of claim 11, wherein an edge of at least one of the firstthrough-hole and the second through-hole comprises an uneven part. 15.The electronic apparatus of claim 11, wherein at least one of the firstthrough-hole and the second through-hole comprises four corner partsdisposed in four different directions from a center, and a curved sideedge is between two neighboring corner parts of the four corner parts.16. The electronic apparatus of claim 15, wherein at least one of thefirst through-hole and the second through-hole comprises a fine concaveportion or a fine protruding portion.
 17. The electronic apparatus ofclaim 15, wherein each of the first through-hole and the secondthrough-hole comprises four corner parts, and the first through-hole andthe second through-hole are arranged such that at least one of thecorner parts of the first through-hole and at least one of the cornerparts of the second through-hole are adjacent to each other.
 18. Theelectronic apparatus of claim 11, wherein the first through-holeentirely surrounds the second through-hole.
 19. The electronic apparatusof claim 11, wherein a width of the first through-hole is about 200 μmto about 300 μm.
 20. The electronic apparatus of claim 11, wherein thecomponent comprises at least one of a sensor and a camera.